Semiconductor structure and method of making same

ABSTRACT

The invention is directed to a structure and method of forming a structure having a sealed gate oxide layer. The structure includes a gate oxide layer formed on a substrate and a gate formed on the gate oxide layer. The structure further includes a material abutting walls of the gate and formed within an undercut underneath the gate to protect regions of the gate oxide layer exposed by the undercut. Source and drain regions are isolated from the gate by the material.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 11/468,403, filed on Aug. 30, 2006, the contents of which areexpressly incorporated by reference herein.

FIELD OF THE INVENTION

The invention relates to a semiconductor structure and method ofmanufacture and, more particularly, to a structure having a sealed gateoxide layer and method of manufacture.

BACKGROUND OF THE INVENTION

A MOSFET device, amongst other features, has a metal oxide capacitor,consisting of a gate and gate oxide layer. In such a device, the gateoxide material is layered underneath the gate spanning between thesource and the drain region of the device. The dielectric constant k ofthe gate oxide material and the thickness d of the gate oxide layerdetermine the capacitance and field homogeneity and thus the deviceperformance. Damage to the gate oxide layer during the manufacturingprocess may result in either device failure or at minimum, in anundesired reduction of device performance. Therefore, in order toachieve satisfactory device performance, the gate oxide layer shouldremain intact during manufacture of the semiconductor device.

In conventional processes, a MOSFET precursor comprises a substrate,e.g., a silicon-on-insulator (SOI) region. A layer of gate oxide isdeposited onto the entire wafer surface. In a subsequent step, apolysilicon gate is fabricated, in conventional manners, at a desiredlocation over the gate oxide layer. At this stage and prior to etchingthe source and drain region, the polysilicon gate is protected bysilicon nitride at its sidewalls and top surface, e.g., a nitridesidewall and cap, respectively. The nitride sidewall and cap layers aretypically very thick, in the ranges of upwards of 20 nm. Once thenitride sidewall and cap layers are formed, the source and drain regionsare etched by anisotropic methods such as reactive ion etching (RIE).This results in the structure comprising a polysilicon gate with thethick nitride sidewall and cap layer, and the underlying gate oxidelayer that is laterally exposed to the source and drain wells.

Prior to filling the source and drain wells with epitaxial material, thewells undergo an isotropic cleaning to remove any native oxide materialthat was generated during the previous steps, e.g., etching of thewells. During this so-called EPI pre-clean step, the oxide material istreated with hydrogen fluoride or similar reagents to generate volatilereaction products. After removal of the volatile products, the surfaceof the source and drain region comprises pure silicon which serves asbasis for growth of the epitaxial material of the source and drainregion.

However, the isotropic EPI pre-clean step also etches away unprotectedareas of the gate oxide layer. That is, during the EPI pre-clean, thegate oxide layer is subject to the removal reagents which removesportions of the gate oxide layer, resulting in an undercut of up to 5 nmor more under the gate. This effectively shortens the length of the gateoxide layer and exposes portions of the gate. Prior to removing thenitride sidewall, the wells are filled to form the source and drainregion. The material, which is used to fill the source and drain, willalso fill the undercut region and hence come into direct contact withthe gate.

Thus, if the gate oxide is undercut too much, the material for fillingthe source and drain region will come into contact with the gate,itself. This will result in failure of the device. Accordingly, to avoiddevice failure, in conventional device manufacture, the protectivesidewalls are 10 nm or thicker to ensure that the undercut, during thecleaning process, does not corrode the gate oxide to such an extent thatthe gate becomes exposed in the undercut. However, due to the thicknessof the sidewalls, i.e., 10 nm or greater, the conventional device has asource well to drain well distance greater than the actual gate length,thus ensuring that there will be no shorting but also negativelyaffecting device performance.

SUMMARY OF THE INVENTION

In a first aspect, the present invention is directed to a structurecomprising a gate oxide layer formed on a substrate and a gate formed onthe gate oxide layer. The structure further includes a material abuttingwalls of the gate and formed within an undercut underneath the gate toprotect regions of the gate oxide layer exposed by the undercut. Sourceand drain regions are isolated from the gate by the material.

In another aspect, the invention is directed towards a method formanufacturing a device. The method comprises forming a layer on asubstrate and forming a gate on the layer. An undercut is formed underthe gate by removing portions of the layer. A barrier layer is formedwithin the undercut to protect the layer from corrosion duringsubsequent processing steps. Source and drain regions are alsoprocessed.

In a further aspect, the method includes forming a gate on a substrate.The gate includes a gate oxide layer formed between the substrate andthe gate. The method further includes etching portions of the gate oxidelayer to form an undercut under the gate. The exposed portions of thegate oxide layer are protected while forming sidewalls abutting thegate. The source and drain wells are formed into the substrate adjacentthe gate and filled with conductive material.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 show manufacturing processes in accordance with the invention;

FIG. 6 shows a final processing step in accordance with the invention,in addition to a final structure;

FIGS. 7-11 show alternative manufacturing processes in accordance withthe invention; and

FIG. 12 shows a final processing step in accordance with the invention,in addition to a final structure.

DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE INVENTION

FIG. 1 shows a beginning structure in accordance with the invention. Inthis beginning structure, a SOI 12 is embedded in a substrate 10. Thesubstrate may be BOX. A gate oxide layer 14, for example, is blanketgrown onto the SOI 12 and optionally on the substrate 10 using anyconventional method such as, for example, without limiting the scope ofthe invention, thermally grown oxide with nitrogen enrichment orchemical vapor deposition processes. These chemical vapor depositionprocesses may include low-pressure chemical vapor deposition (LPCVD) or,if the desired gate oxide necessitates, metal organic CVD (MOCVD).

The gate oxide layer 14 can comprise any appropriate metal oxidematerial. The gate oxide layer 14 is, in embodiments, determined by thedesired capacitance of the gate using a high dielectric constant (k)material with low dielectric leakage current, for example. Inembodiments, the gate oxide layer may be exchanged with a nitride layeror other appropriate material such as, for example, silicon oxide. Infurther embodiments, the gate layer 14 can comprise a thickness betweenapproximately 0.5 nm to 3 nm. However, the thickness of the gate oxidelayer 14 may vary depending on any number of known parameters such asthe gate oxide material, itself. Therefore, in view of the variousfactors for generating a desired capacitance, thickness outside theabove-described region are equally contemplated by the invention.

Still referring to FIG. 1, a gate 16 is formed at any desired locationon the gate oxide layer 14 above the SOI region 12. The gate 16 cancomprise any appropriate material. In embodiments, the gate 16 is madeof polysilicon; however, based on device performance and the gate oxidematerial, the gate material can be of any material necessary to warrantthe desired performance. For example, if a gate oxide material has adielectric constant higher than the dielectric constant of silicondioxide (high-k material), then a gate can be made of more compatiblematerial including metals. The gate 16 is capped by a protective barrierlayer 18 which can be made of any material used for protecting parts ofa semiconductor device such as, for example, nitride material.

FIG. 2 shows further process steps in accordance with the invention. Asshown in FIG. 2, excess material from the gate oxide layer 14, notcovered by the gate 16, is removed during this processing step. Duringthis stage of processing, an undercut is formed under the gate 16. Anyconventional method can be used to remove portions of the gate oxidelayer 14 including isotropic and anisotropic methods or any dry or wetmethods. In embodiments, the removal process is chosen based on the typeand thickness of the gate oxide. In embodiments, for example, if thegate oxide is silicon oxide, the removal process can include usinghydrogen fluoride in any form, such as gas, liquid, solution, in mixturewith other agents, buffered, diluted or anhydrous.

In embodiments, an isotropic etching leads to lateral removal ofmaterial underneath the gate 16 causing an undercut. Such undercutunderneath the gate 16 can reach dimensions of up to 5 nm per side.

FIG. 3 shows further process steps in accordance with the invention. Inthis processing step, a protective barrier material such as nitride isformed on the sidewalls of the gate 16 to form a protective layer 20.The protective barrier material also covers exposed portions of the gateoxide layer 14 in the undercut underneath the gate 16. The protectivelayer 20 can be formed in any conventional manner, known to those ofskill in the art such as, for example, nitride deposition processes suchas plasma enhanced chemical vapor deposition (PECVD) or rapid thermalchemical vapor deposition (RTCVD).

As shown in FIG. 3, the gate stack is completely enclosed by theprotective barrier layers 18 and 20, in addition to the SOI material 12.In this manner, the sealed structure is now protected from any furtherprocessing steps, as described in greater detail below. Thus, duringsubsequent cleaning steps, the gate oxide layer will not be exposed toetchant chemistries, thus ensuring that the gate oxide layer will remainintact. This, in turn, ensures that the gate, itself, will not becomeexposed during subsequent steps, thus preventing short circuits in thedevice.

In embodiments, the sidewalls which are formed from the protective layer20 do not require added thickness to avoid undercut erosion of the gateoxide 12 in subsequent processing steps. This is due to the fact thatthe protective barrier 20 is provided within the undercut, as comparedto conventional methods which do not have any protective material withinthe undercut. Thus, in the case of this embodiment, the sidewalls formedfrom the protective layer 20 can be 10 nm or less in thickness and, evenwith this thickness, under gate erosion can be avoided. This willprevent shorts from occurring in subsequent processing steps.

Also, it is important to note that since the gate stack is nowcompletely enclosed, no additional material, e.g., precautionarythickness for the sidewalls, is necessary to prevent gate oxidecorrosion and gate undercut. Thus, the thickness of the sidewalls can bereduced to the minimum necessary for protecting the gate stack fromexposure to any subsequent process steps. This in turn, also reduces thedistance between the gate oxide and the source and drain regions.

FIG. 4 shows additional process steps in accordance with the invention.In these processing steps, etching is performed to form the source anddrain (S/D) wells 21. The formation of the source and drain wells 21 canbe accomplished using anisotropic etching such as RIE. As is shown inFIG. 4, there is a difference between the gate length (well to welldistance) and the transistor length (length of gate oxide in contactwith SOI). This difference is approximately two times the sidewallthickness of the protective layer 20 at the level of the gate oxide 12.However, this distance is significantly decreased, compared toconventional structures and methods, since the protective layer 20 is 10nm or less at the sidewalls, owing to the manufacturing processesdescribed herein. Thus, applying the present method, the length of thegate oxide can be increased by approximately 0.2 nm or more by selectingan appropriate sidewall 20 thickness. In this manner, transistorefficiency is substantially increased over that of the known art.

FIG. 5 shows further process steps in accordance with the invention. InFIG. 5, the source and drain wells 21 are filled with epitaxial material22. In embodiments, the source and drain wells 21 are filled with SiGethat is epitaxially grown. By filling the source and drain wells 21 withSiGe, the device may be placed in a compressive strain which ispreferred for a PFET device. Although this embodiment exemplifies theaspects of the invention with use of a PFET device, it is obvious thatthe same method can be used during the manufacture of a NFET device orboth, e.g., CMOS devices. In embodiments, the SiGe composition can be ofvarious different ratios, e.g., the atomic Ge content can be between 0.1and 50 atomic %, preferably between 1 and 40 atomic %, and morepreferably between 5 and 30 atomic %.

FIG. 6 shows another processing step of the invention, in addition to afinal structure. In the processing step of FIG. 6, the protective layer20 is removed using any conventional method known to those of skill inthe art. As shown, using the processes described herein, and moreparticularly, the protective layer 20, the gate 16 and gate oxide layer14 remain separated from the source and drain material thus preventingany shorts from occurring in the device.

It is noted that the device performance increases using the fabricationmethod of the invention. For example, shorting of the device isprevented. In addition, the eSiGe grown source/drain edge can be closerto the transistor channel, improving transistor performance.

FIGS. 7-12 show an alternative method of fabricating a structure inaccordance with the invention. FIGS. 7-9 show the same processing stepsas described with reference to FIGS. 1-3. By way of example, FIG. 7shows a beginning structure in accordance with the invention. In thisbeginning structure, a SOI 12 is embedded in a substrate 10. A gateoxide layer 14 is blanket grown onto the SOI 12 and optionally on thesubstrate 10 using any conventional method as described above. The gateoxide material can comprise any appropriate metal oxide materialincluding silicon oxide and can comprise a thickness betweenapproximately 0.1 nm and 7 nm.

Still referring to FIG. 7, a gate 16 is formed at any desired locationon the gate oxide layer 14 above the SOI region 12. The gate 16 cancomprise any appropriate material such as of polysilicon. However, basedon device performance and the desired gate oxide material, the gatematerial can be of any appropriately known material to warrant thedesired performance, as describe with reference to FIG. 1.

As shown in FIG. 8, excess gate oxide material 14, not covered by thegate 16, is removed using any conventional processing. In embodiments,an isotropic method leads to lateral removal of material underneath thegate 16 resulting in an undercut under the gate 16. Such undercutunderneath the gate 16 can reach dimensions of up to 5 nm per side.

FIG. 9 shows further process steps in accordance with the invention. Inthese processing steps, a protective layer 20 is formed on the sidewallsof the gate 16. As with FIG. 3, the protective layer 20 also coversexposed portions of the gate oxide layer 14 in the undercut underneaththe gate 16. The gate stack is now completely enclosed by the protectivebarrier material layers 18 and 20, in addition to the SOI 12. In thismanner, the sealed structure is now protected from any furtherprocessing steps. The protective layer 20 can be formed in anyconventional manner, known to those of skill in the art.

As in the previous embodiment described above, the sidewalls formed fromthe protective layer 20 do not require added thickness to avoid undercuterosion in subsequent processing steps. This is due to the protectivelayer 20 being provided within the undercut thus protecting the oxidelayer from any corrosion. In the case of this embodiment, the thicknessof the sidewalls formed from the protective layer 20 can besignificantly minimized to about 10 nm or less in thickness and, again,gate erosion can be avoided. This will prevent shorts from occurring insubsequent processing steps.

Thus, as with the previous embodiment, since the gate stack is nowcompletely enclosed, no additional material, e.g., precautionarythickness for the sidewalls, is necessary to prevent gate oxidecorrosion and gate undercut. Thus, the thickness of the sidewalls can bereduced to the minimum necessary for protecting the gate stack fromexposure to any subsequent process steps.

FIG. 10 shows alternative processing steps in accordance with theinvention. An isotropic etching process is used to form the source anddrain wells 21. As is shown in FIG. 10, although the isotropic etchingcauses an undercut under the gate 16, the protective layer 20 remainsintact, protecting the gate oxide layer 14 from being eroded. This willprevent any future shorting of the device. More specifically, this willprevent the corrosion of the oxide layer 14 from reaching beyond thegate 16, thus avoiding exposure of the gate material.

In FIG. 11, the source and drain wells 21 are filled with material 22,similar to that described with reference to FIG. 5. Here, again, thematerial can be any material suitable for achieving the desired deviceperformance. Also, further process steps to implement the invention.

Still referring to FIG. 11, the processes described herein and moreparticularly the use of the isotropic etching process in combinationwith the protective layer 20, results in the gate and the source anddrain regions approaching extreme proximity. More specifically, thesource and drain regions are formed under the gate 16, beyond at least aportion or outer edge of the undercut. Thus, using the methods describedherein produces devices with improved performance, while preventing anyshorting from occurring.

FIG. 12 shows the device after the removal of the protective material20. As described with reference to FIG. 6, the gap can further be filledwith material to improve device performance, such as gate oxide.

The methods as described above are used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

While the invention has been described in terms of embodiments, thoseskilled in the art will recognize that the invention can be practicedwith the modification within the spirit and scope of the appendedclaims. For example, the invention can be readily applicable to bulksubstrates.

1. A method for manufacturing a device, comprising: forming a layer on asubstrate; forming a gate on the layer; forming an undercut under thegate by removing portions of the layer; forming a barrier layer withinthe undercut to protect the layer from corrosion during subsequentprocessing steps; and processing source and drain regions.
 2. The methodaccording to claim 1, wherein the layer is an oxide layer.
 3. The methodaccording to claim 1, further comprising removing the barrier layerafter processing of the source and drain regions
 4. The method accordingto claim 1, wherein the processing includes a pre-cleaning prior tofilling the source and drain regions with material.
 5. The methodaccording to claim 1, wherein the processing of the source and drainregions includes forming wells beyond an edge of the undercut, below thegate.
 6. The method according to claim 1, wherein the barrier layerforms sidewalls abutting the gate which are of a thickness of less than10 nm.
 7. The method according to claim 1, wherein the removing portionsof the layer comprises hydrofluoric acid etching.
 8. The methodaccording to claim 1, wherein the processing of the source and drainregions includes isotropic or anisotropic etching of source and drainwells.
 9. The method according to claim 1, wherein the protectivebarrier electrically isolates the gate from the source and drainregions.
 10. A method for forming a gate oxide seal, comprising: forminga gate on a substrate including a gate oxide layer formed between thesubstrate and the gate; etching portions of the gate oxide layer therebyforming an undercut under the gate; protecting exposed portions of thegate oxide layer while forming sidewalls abutting the gate; etchingsource and drain wells into the substrate adjacent the gate; and fillingthe source and drain wells with conductive material.
 11. The methodaccording to claim 10, wherein the etching of source and drain wellscomprises isotropic or anistropic etching and the protecting steps sealsthe gate oxide layer from the conductive material with portions of thenon-conductive sidewalls.
 12. The method according to claim 10, whereinthe filling of the source and drain wells comprises epitaxially growingsilicon germanium material.
 13. A method of forming a structure,comprising: forming a gate oxide layer on a substrate; forming a gate onthe gate oxide layer; forming a material about walls of the gate andformed within an undercut underneath the gate to protect regions of thegate oxide layer exposed by the undercut; and isolating source and drainregions from the gate by the material.
 14. The method according to claim13, wherein the gate oxide layer comprises high dielectric constant(high-k) material.
 15. The method according to claim 13, wherein thesource and drain regions are grown epitaxially from silicon germaniummaterial.
 16. The method according to claim 13, wherein the gate oxidelayer has a thickness from about 0.5 nm to about 3 nm.
 17. The methodaccording to claim 13, wherein the material is a protective barrierlayer of silicon nitride forming sidewalls.
 18. The method according toclaim 13, wherein the material about the walls of the gate is athickness of less than 10 nm.
 19. The method according to claim 13,wherein the source and drain regions are formed under the gate, beyondat least a portion of the undercut.